Rudolph Technologies收获多笔订单 后端制造回暖
来源:大半导体产业网发布时间:2009-09-18995浏览
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为晶圆制造机封装提供性能测试设备及软件的供应商Rudolph Technologies日前表示,公司接获了来自四家封测公司及晶圆厂商订购20套Rudolph自动微缺陷监测设备的订单,订单总额在60万至120万美元之间。
Rudolph营销副总裁表示:“这些订单显示出了自2008年第三季以来未曾出现的积极迹象。大部分的订单来自于台湾,我们期待着在本月的SEMICON Taiwan上能够有更多令人振奋的消息。”
Rudolph Technologies Indicates Recovery Taking Hold, Back-end Semiconductor Manufacturing Heating Up
Strong orders coming from industry’s largest four OSATs and major foundries; sets the stage for upbeat SEMICON Taiwan in late September
FLANDERS, NJ (Sept. 16, 2009)—Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization equipment and software for wafer fabrication and advanced packaging facilities, today announced that is has received orders for 20 tools from the world’s four largest outsourced assembly and test (OSAT) companies and major foundry companies. The orders are for Rudolph’s automated macro defect inspection equipment, which typically sell within a range of $600k to $1.2m.
“These orders represent a level of activity not seen since Q3 of 2008,” stated Ardy Johnson, vice president of marketing at Rudolph. “With the majority of this tool demand coming out of Taiwan, we are anticipating an upbeat SEMICON? Taiwan exhibition this month.”
“Rudolph leads the market in back-end macro defect inspection. Therefore, this long-anticipated upswing in assembly and test purchasing will prove quite beneficial for our overall business,” Johnson continued. “These recent orders have likewise confirmed the achieved customer-value resulting from Rudolph’s on-going development of new 2D and 3D inspection tools during the past industry down-turn, incorporating unique data analysis software packages that can classify defects and determine defect trends?all part of our complete solution in final test,” added Johnson. “In past industry cycle up-turns, the back-end market segment has typically been a leading indicator of future purchasing activity in the front-end wafer fabs,” Johnson concluded. “Recognizing Rudolph’s leading position in the front-end market for our inspection and metrology solutions, we are anxiously preparing for the next significant industry-wide ramp. We have continued our 2009 product development investment, which, for example, has enabled us to add enhanced resolution of measurements and defect detectability, while further increasing tool productivity. Product improvements such as this can be expected to result in ever stronger competitive positioning in meeting customers’ needs and expectations, and in what we believe will be a measurable market share gain for Rudolph.”
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph’s strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company’s web site at www.rudolphtech.com.
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