Amkor

规格书列表共 9 项

选择	型号	操作	更新时间
	CABGA		2025-09-16
	CABGA_FBGA_DS550		2023-07-07
	Challenges-and-Approaches-to-Developing-Automotive-Grade-10-FCBGA-Package-Capability-Amkor-Whitepaper-EN		2025-08-19
	Challenges-in-automotive-packaging-technologies-YoleAmkor_REPRINT		2023-07-07
	Challenges-of-Advanced-High-Speed-Digital-Product-Test-MEPTEC-REPORT-SPRING-2021-EN		2023-07-07
	Chip-Board-Interaction-Analysis-of-22nm-FD-SOI-Technology-in-WLP		2024-01-24
	Chip-scale-Power-Transistor-Packaging-CSR-Dec-2020-Article-EN		2023-07-07
	CopperWirebond_TS105		2023-07-07
	Copper_Pillar_Flip_Chip_TS106		2023-07-07